Metal stamping plant first brand [Branch] Shenzhen Branch precision molds metal factory is a metal stamping and production-oriented enterprises, Main: various types of precision metal stamping dies, metal stamping shrapnel, auto metal parts, precision pull stretch, metal clips, heat sinks, mobile power shell. And to provide design and drawing services, reduction in product design changes, shorten the development cycle to address mold and part design and processing to worry about, so that products to market faster. The factory has advanced mold design software and advanced design engineers, mold manufacturing technicians, relying on professional design technology, combined with years of practical experience, quality of quality-based, market demand-oriented, won recognition at home and abroad and support. ????? Heat sink is hot to help dissipate the operation of the integrated circuit generated when, in order to enhance the effectiveness of the cooling device, with the promotion of the development of electronic technology and wafer manufacturing process, the relative efficiency of electronic components increased, while heat emitted per unit volume also more and more, in order to maintain its normal operating state, the heat exchange operation is also quite important. Today Shenzhen heatsink manufacturers to introduce the application method and the role of the heat sink. The easiest way is to use the concept of resistance to design, thermal resistance in the electronic thermal management techniques are important design parameter, is defined as R = ΔT / P where ΔT is the temperature difference, P is the wafer of heat consumption. Thermal heat transfer element representative of the degree of difficulty, the greater the resistance, the component cooling effect was worse, if the resistance is smaller, more easily represents the component cooling. IC package will be generated after the installation of the wafer fin heat up most of the heat transfer through the heat sink, the thermal resistance posed by the Internet's point of view, and it includes the heat generated by the chip to the package by a shell of thermal Rjc, hot from the package surface to the bottom of the heat sink thermal resistance Rcs via interface material to the bottom of the heat sink and the heat from the bottom of the heat sink thermal resistance of the atmosphere reached Rsa three parts. Rcs and surface smoothness, the material properties of the interface material and installation-related stress and material thickness, due to the general characteristics of interface design often ignores the material, and therefore require special attention. By thermal network point of view, the relationship between the thermal resistance can be obtained for Rja = Rjc + Rcs + Rsa = (Tj-Ta) / P heat sink effect that is how to use the appropriate heat sink temperature of the wafer is maintained at set Tj value under the following. However, cost and performance costs must be considered when designing the cooling element, several traditional heat sink and component estimates, the best performance of the heat sink is generally higher cost, if less heat dissipation design, you do not have to use high-performance cost cooling elements. Guangzhou heatsink manufacturers that need to understand the thermal design of the production cost and performance with a heat sink in order to make the fins, to achieve maximum efficiency.